Copyright © Philip M. Parker, INSEAD. Terms of Use.

| Domain | Definition |
Electrical Engineering | A technique for producing diffused junctions in which alloy regions are first formed and then removed by chemical means, only the regrown semiconductor material remaining, and this material then being used as a diffusion source. Source: European Union. (references) |
Source: compiled by the editor from various references; see credits. | |
| Language | Translations for "POST-ALLOY DIFFUSION TECHNIQUE"; alternative meanings/domain in parentheses. | ||||||||||||||||
Danish | PAD-teknik. (various references) | ||||||||||||||||
Dutch | PAD-techniek, diffusie-na-legeren-techniek. (various references) | ||||||||||||||||
Finnish | jälkilejeerausdiffuusiotekniikka. (various references) | ||||||||||||||||
French | technique de diffusion après alliage. (various references) | ||||||||||||||||
German | PAD-Technik. (various references) | ||||||||||||||||
Greek | τεχνική μετακραματικής διάχυσης. (various references) | ||||||||||||||||
Italian | tecnica di diffusione dopo la lega. (various references) | ||||||||||||||||
Pig Latin | ost-alloypay iffusionday echniquetay tecnica de difusao apos liga. (various references) técnica de difusión postaleada. (various references) | ||||||||||||||||
Copyright © Philip M. Parker, INSEAD. Terms of Use.